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A43L2632
Preliminary
Document Title 1M X 32 Bit X 4 Banks Synchronous DRAM Revision History
Rev. No.
0.0
1M X 32 Bit X 4 Banks Synchronous DRAM
History
Initial issue
Issue Date
January 13, 2005
Remark
Preliminary
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A43L2632
Preliminary
Features
JEDEC standard 3.3V power supply LVTTL compatible with multiplexed address Four banks / Pulse RAS MRS cycle with address key programs - CAS Latency (2,3) - Burst Length (1,2,4,8 & full page) - Burst Type (Sequential & Interleave) All inputs are sampled at the positive going edge of the system clock Deep Power Down Mode Burst Read Single-bit Write operation Clock Frequency (max) : 166MHz @ CL=3 (-6) 143MHz @ CL=3 (-7)
1M X 32 Bit X 4 Banks Synchronous DRAM
DQM for masking Auto & self refresh 64ms refresh period (4K cycle) Self refresh with programmable refresh period through EMRS cycle Programmable Power Reduction Feature by partial array activation during Self-refresh through EMRS cycle 86 Pin TSOP (II) operating temperature range: 0C to + 70C
General Description
The A43L2632 is 67,108,864 bits Low Power synchronous high data rate Dynamic RAM organized as 4 X 1,048,576 words by 32 bits, fabricated with AMIC's high performance CMOS technology. Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system applications.
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Pin Configuration
TSOP (II)
VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 NC VDD DQM0 WE CAS RAS CS A11 BA0 BA1 A10/AP A0 A1 A2 DMQ2 VDD NC DQ16 VSSQ DQ 17 DQ18 VDDQ DQ19 DQ20 VSSQ DQ21 DQ22 VDDQ DQ23 VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44
VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 NC VSS DQM1 NC NC CLK CKE A9 A8 A7 A6 A5 A4 A3 DMQ3 VSS NC DQ31 VDDQ DQ30 DQ29 VSSQ DQ 28 DQ27 VDDQ DQ26 DQ25 VSSQ DQ24 VSS
A43L2632
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Block Diagram
LWE I/O Control
Data Input Register Bank Select
DQM
1M X 32 Row Decoder Output Buffer Sense AMP 1M X 32 1M X 32 1M X 32
Row Buffer Refresh Counter
CLK Address Register
DQi
LCBR
LRAS
ADD
Column Decoder
Column Buffer
Latency & Burst Length
LRAS
LCAS LRAS LCBR LWE
Programming Register DQM LWCBR
Timing Register
CLK
CKE
CS
RAS
CAS
WE
DQM
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Pin Descriptions
Symbol Name Description
CLK
CS
System Clock Chip Select
Active on the positive going edge to sample all inputs. Disables or Enables device operation by masking or enabling all inputs except CLK, CKE and L(U)DQM Masks system clock to freeze operation from the next clock cycle.
CKE
Clock Enable
CKE should be enabled at least one clock + tss prior to new command. Disable input buffers for power down in standby. Row / Column addresses are multiplexed on the same pins.
A0~A11
Address Row address : RA0~RA11, Column address: CA0~CA7 Selects bank to be activated during row address latch time.
BS0, BS1
Bank Select Address Selects band for read/write during column address latch time. Row Address Strobe Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge. Column Address Strobe
Write Enable Data Input/Output Mask Data Input/Output Power Supply/Ground Data Output Power/Ground No Connection
RAS
Latches column addresses on the positive going edge of the CLK with CAS low. Enables column access.
Enables write operation and Row precharge. Makes data output Hi-Z, t SHZ after the clock and masks the output. Blocks data input when DQM0-3 active. Data inputs/outputs are multiplexed on the same pins. Power Supply: +3.3V0.125V/Ground Provide isolated Power/Ground to DQs for improved noise immunity.
CAS
WE DQM0-3 DQ0-31 VDD/VSS VDDQ/VSSQ NC/RFU
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Absolute Maximum Ratings*
Voltage on any pin relative to VSS (Vin, Vout ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +3.6V Voltage on VDD supply relative to VSS (VDD, VDDQ ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to + 3.6V Storage Temperature (TSTG) . . . . . . . . . . -55C to +150C Soldering Temperature X Time (TSLODER) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C X 10sec Power Dissipation (PD) . . . . . . . . . . . . . . . . . . . . . . . . .0.8W Short Circuit Current (Ios) . . . . . . . . . . . . . . . . . . . . 50mA
*Comments
Permanent device damage may occur if "Absolute Maximum Ratings" are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
Capacitance (TA=25C, f=1MHz)
Parameter Symbol Condition Min Typ Max Unit
Input Capacitance
CI1 CI2
A0 to A10, BA0, BA1 CLK, CKE, CS , RAS , CAS , WE , DQM DQ0 to DQ31
2.5 3 4
4 5.5 6.5
pF pF pF
Data Input/Output Capacitance
CI/O
DC Electrical Characteristics
Recommend operating conditions (Voltage referenced to VSS = 0V, TA = 0C to +70C or TA = -40C to +85C )
Parameter Symbol Min Typ Max Unit Note
Supply Voltage Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Input Leakage Current Output Leakage Current Output Loading Condition
VDD,VDDQ VIH VIL VOH VOL IIL IOL
3 2 -0.3 2.0 -5 -5
3.3 0 -
3.6 VDD+0.3 0.8 0.4 5 5
V V V V V
A A
Note 1 IOH = -1mA IOL = 1mA Note 2 Note 3
See Figure 1
Note: 1. VIL (min) = -2.0V AC (pulse width 3ns). 2. Any input 0V VIN VDD + 0.3V, all other pins are not under test = 0V 3. Dout is disabled, 0V Vout VDD
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Decoupling Capacitance Guide Line
Recommended decoupling capacitance added to power line at board.
Parameter Symbol Value Unit F F
Decoupling Capacitance between VDD and VSS Decoupling Capacitance between VDDQ and VSSQ
CDC1 CDC2
0.1 + 0.01 0.1 + 0.01
Note: 1. VDD and VDDQ pins are separated each other. All VDD pins are connected in chip. All VDDQ pins are connected in chip. 2. VSS and VSSQ pins are separated each other All VSS pins are connected in chip. All VSSQ pins are connected in chip.
DC Electrical Characteristics
(Recommended operating condition unless otherwise noted, TA = 0 to 70C or TA = -40C to +85C )
Symbol Parameter Test Conditions -6 Speed -7
80
Unit
Notes
Icc1 Icc2 P Icc2 PS ICC2N
Operating Current (One Bank Active) Precharge Standby Current in power-down mode
Burst Length = 1 tRC tRC(min), tCC tCC(min), IOL = 0mA CKE VIL(max), tCC = 15ns CKL VIL(max), tCC = CKE VIH(min), CS VIH(min), tCC = 15ns Input signals are changed one time during 30ns CKE VIH(min), CLK VIL(max), tCC = Input signals are stable.
85
mA
1
45 3
40 3
mA
Precharge Standby Current in non power-down mode
8
mA
ICC2NS Active Standby current in non power-down mode (One Bank Active) Operating Current (Burst Mode) Refresh Current Self Refresh Current
1
ICC3N
CKE VIH(min), CS VIH(min), tCC = 15ns Input signals are changed one time during 30ns IOL = 0mA, Page Burst All bank Activated, tCCD = tCCD (min) tRC tRC (min) CKE = 0.2V
65
60
mA
ICC4 ICC5 ICC6
200
170
170
3
mA mA mA
1 2
180
3
Note: 1. Measured with outputs open. Addresses are changed only one time during tCC(min). 2. Refresh period is 64ms. Addresses are changed only one time during tCC(min).
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AC Operating Test Conditions
(VDD = 3.3V 0.3V, TA = 0C to +70C or TA = -40C to +85C)
Parameter Value
AC input levels Input timing measurement reference level Input rise and all time (See note3) Output timing measurement reference level Output load condition
VIH/VIL = 2.4V/0.4V 1.4V tr/tf = 1ns/1ns 1.4V See Fig.2
2.5V 1200 Output OUTPUT 870 30pF VOH(DC) = 2.0V, IOH = -1mA VOL(DC) = 0.4V, IOL = 1mA VTT =1.05V 50 ZO=50 30pF
(Fig. 1) DC Output Load Circuit
(Fig. 2) AC Output Load Circuit
AC Characteristics
(AC operating conditions unless otherwise noted)
Symbol Parameter Min -6 Max Min -7 Max Unit Note
CL=3 tCC CLK cycle time CL=2 CLK to valid tSAC Output delay Output data hold time CLK high pulse width CL=3 CL=2
6 1000 7.5 2.75 2 5.5 6 -
7 1000 7.5 3 2.5 5.5 6 ns ns 2 3 ns 1,2 ns 1
tOH tCH
CL=CAS Latency.
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AC Characteristics (continued)
(AC operating conditions unless otherwise noted)
-6 Symbol Parameter Min Max Min Max -7 Unit Note
tCL
CLK low pulse width CL=3
2 1.5 2.5 1 1 CL=3 -
5.5 6
2.5 1.75 2.5 1 1 -
5.5 6
ns ns
3 3
tSS
Input setup time CL=2
tSH tSLZ
Input hold time CLK to output in Low-Z
ns ns ns
3 2
tSHZ
CLK to output in Hi-Z CL=2
CL=CAS Latency.
*All AC parameters are measured from half to half.
Note : 1. Parameters depend on programmed CAS latency. 2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter. 3. Assumed input rise and fall time (tr & tf) = 1ns. If tr & tf is longer than 1ns, transient time compensation should be considered, i.e., [(tr + tf)/2-1]ns should be added to the parameter.
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Operating AC Parameter
(AC operating conditions unless otherwise noted)
Version Symbol Parameter -6 -7 Unit Note
tRRD(min) tRCD(min) tRP(min) tRAS(min)
Row active to row active delay RAS to CAS delay Row precharge time
12 15 15 42
15 15 15 42 100
ns ns ns ns
s
1 1 1 1
Row active time tRAS(max) tRC(min) tCDL(min) tRDL(min) tBDL(min) tCCD(min) Row cycle time Last data in new col. Address delay Last data in row precharge Last data in to burst stop Col. Address to col. Address delay 63 6 12 6 1
65 7 14 7 1
ns ns ns ns ns
1 2 2 2
Note: 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then rounding off to the next higher integer. 2. Minimum delay is required to complete write.
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Simplified Truth Table
Command CKEn-1 CKEn
CS
RAS CAS
WE DQM BS0 A10 A9~A0,
BS1 /AP
Notes
Register Refresh
Mode Register Set Auto Refresh Self Refresh Entry Exit
H H L H H H H
X H L H X X X X X L H L H
L L L H L L L L L L H X L H L H L H L X
L L H X L H H H L H X X H X V X X H X H X
L L H X H L L H H H X X H X V X H X H X
L H H X H H L L L H X X H X V X H X L X
X X X X X X X V V V V
OP CODE X X Row Addr. L H L H X L H X X Column Addr. Column Addr.
1,2 3 3 3 3 4 4 4,5 4 4,5
Bank Active & Row Addr. Read & Auto Precharge Disable Column Addr. Auto Precharge Enable Write & Auto Precharge Disable Column Addr. Auto Precharge Enable Burst Stop Precharge Bank Selection Both Banks Clock Suspend or Active Power Down Entry Exit Entry Precharge Power Down Mode Exit DQM No Operation Command Deep Power Down Entry Deep Power Down Exit
H H L H L H H H L
X X
X X X X X V X X X X X X X 7 6
X L H
(V = Valid, X = Don't Care, H = Logic High, L = Logic Low)
Note : 1. OP Code: Operand Code A0~A10, BS0, BS1: Program keys. (@MRS) 2. MRS can be issued only when all banks are at precharge state. A new command can be issued after 2 clock cycle of MRS. 3. Auto refresh functions is same as CBR refresh of DRAM. The automatical precharge without Row precharge command is meant by "Auto". Auto/Self refresh can be issued only when all banks are at precharge state. 4. BS0, BS1 : Bank select address. If both BS1 and BS0 are "Low" at read, write, row active and precharge, bank A is selected. If both BS1 is "Low" and BS0 is "High" at read, write, row active and precharge, bank B is selected. If both BS1 is "High" and BS0 is "Low" at read, write, row active and precharge, bank C is selected. If both BS1 and BS0 are "High" at read, write, row active and precharge, bank D is selected. If A10/AP is "High" at row precharge, BS1 and BS0 is ignored and all banks are selected. 5. During burst read or write with auto precharge, new read/write command cannot be issued. Another bank read/write command can be issued at every burst length. 6. DQM sampled at positive going edge of a CLK masks the data-in at the very CLK (Write DQM latency is 0) but masks the data-out Hi-Z state after 2 CLK cycles. (Read DQM latency is 2) 7. After Deep Power Down mode exit, a full new initialization of the memory device is mandatory.
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Mode Register Filed Table to Program Modes
Register Programmed with MRS
Address BS1 BS0 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Function
0
0
(Note 3)
RFU
(Note 2)
W.B.L
(Note 1)
TM
CAS Latency
BT
Burst Length
Test Mode A8 A7 Type A6
CAS Latency A5 A4 Latency
Burst Type A3 Type A2 A1
Burst Length A0 BT=0 BT=1
0 0 1 1
0 1 0 1
Mode Register Set Vendor Use Only
0 0 0 0 1 1 1 1
0 0 1 1 0 0 1 1
0 1 0 1 0 1 0 1
Reserved 1 2 3 Reserved Reserved Reserved Reserved
0 1
Sequential Interleave
0 0 0 0 1 1 1 1
0 0 1 1 0 0 1 1
0 1 0 1 0 1 0 1
1 2 4 8 Reserved Reserved Reserved 256(Full)
1 2 4 8 Reserved Reserved Reserved Reserved
Write Burst Length A9 Length
0 1
Burst Single Bit
Note : 1. RFU(Reserved for Future Use) should stay "0" during MRS cycle. 2. If A9 is high during MRS cycle, "Burst Read Single Bit Write" function will be enabled. 3. BS0,BS1 must be 0,0 to select the Mode Register (vs. the Extended Mode Register).
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Power Up Sequence
1. Apply power and start clock, Attempt to maintain CKE = "H", DQM = "H" and the other pins are NOP condition at inputs. 2. Maintain stable power, stable clock and NOP input condition for a minimum of 200s. 3. Issue precharge commands for all banks of the devices. 4. Issue 2 or more auto-refresh commands. 5. Issue a mode register set command to initialize the mode register. cf.) Sequence of 4 & 5 may be changed. The device is now ready for normal operation.
Burst Sequence (Burst Length = 4) Initial address Sequential A1 A0 Interleave
0 0 1 1
0 1 0 1
0 1 2 3
1 2 3 0
2 3 0 1
3 0 1 2
0 1 2 3
1 0 3 2
2 3 0 1
3 2 1 0
Burst Sequence (Burst Length = 8)
Initial address Sequential A2 A1 A0 Interleave
0 0 0 0 1 1 1 1
0 0 1 1 0 0 1 1
0 1 0 1 0 1 0 1
0 1 2 3 4 5 6 7
1 2 3 4 5 6 7 0
2 3 4 5 6 7 0 1
3 4 5 6 7 0 1 2
4 5 6 7 0 1 2 3
5 6 7 0 1 2 3 4
6 7 0 1 2 3 4 5
7 0 1 2 3 4 5 6
0 1 2 3 4 5 6 7
1 0 3 2 5 4 7 6
2 3 0 1 6 7 4 5
3 2 1 0 7 6 5 4
4 5 6 7 0 1 2 3
5 4 7 6 1 0 3 2
6 7 4 5 2 3 0 1
7 6 5 4 3 2 1 0
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Device Operations
Clock (CLK)
command decoder so that RAS , CAS and WE , and all the address inputs are ignored.
Power-Up
The clock input is used as the reference for all SDRAM operations. All operations are synchronized to the positive going edge of the clock. The clock transitions must be monotonic between VIL and VIH. During operation with CKE high all inputs are assumed to be in valid state (low or high) for the duration of set up and hold time around positive edge of the clock for proper functionality and ICC specifications.
Clock Enable (CLK)
The clock enable (CKE) gates the clock onto SDRAM. If CKE goes low synchronously with clock (set-up and hold time same as other inputs), the internal clock is suspended from the next clock cycle and the state of output and burst address is frozen as long as the CKE remains low. All other inputs are ignored from the next clock cycle after CKE goes low. When all banks are in the idle state and CKE goes low synchronously with clock, the SDRAM enters the power down mode from the next clock cycle. The SDRAM remains in the power down mode ignoring the other inputs as long as CKE remains low. The power down exit is synchronous as the internal clock is suspended. When CKE goes high at least "tSS + 1 CLOCK" before the high going edge of the clock, then the SDRAM becomes active from the same clock edge accepting all the input commands.
Bank Select (BS0, BS1)
The following sequence is recommended for POWER UP 1. Power must be applied to either CKE and DQM inputs to pull them high and other pins are NOP condition at the inputs before or along with VDD (and VDDQ) supply. The clock signal must also be asserted at the same time. 2. After VDD reaches the desired voltage, a minimum pause of 200 microseconds is required with inputs in NOP condition. 3. All banks must be precharged now. 4. Perform a minimum of 2 Auto refresh cycles to stabilize the internal circuitry. 5. Perform a MODE REGISTER SET cycle to program the CAS latency, burst length and burst type as the default value of mode register is undefined. At the end of one clock cycle from the mode register set cycle, the device is ready for operation. When the above sequence is used for Power-up, all the out-puts will be in high impedance state. The high impedance of outputs is not guaranteed in any other power-up sequence. cf.) Sequence of 4 & 5 may be changed.
Mode Register Set (MRS)
This SDRAM is organized as 4 independent banks of 524,288 words X 32 bits memory arrays. The BS0, BS1 inputs is latched at the time of assertion of RAS and CAS to select the bank to be used for the operation. The bank select BS0, BS1 is latched at bank activate, read, write mode register set and precharge operations.
Address Input (A0 ~ A11)
The 19 address bits required to decode the 524,288 word locations are multiplexed into 11 address input pins (A0~A11). The 11 bit row address is latched along with RAS , BS0 and BS1 during bank activate command. The 8 bit column address is latched along with CAS , WE , BS0 and BS1during read or write command.
NOP and Device Deselect
When RAS , CAS and WE are high, the SDRAM performs no operation (NOP). NOP does not initiate any new operation, but is needed to complete operations which require more than single clock like bank activate, burst read, auto refresh, etc. The device deselect is also a NOP and is entered by asserting CS high. CS high disables the
The mode register stores the data for controlling the various operation modes of SDRAM. It programs the CAS latency, addressing mode, burst length, test mode and various vendor specific options to make SDRAM useful for variety of different applications. The default value of the mode register is not defined, therefore the mode register must be written after power up to operate the SDRAM. The mode register is written by asserting low on CS , RAS , CAS , WE (The SDRAM should be in active mode with CKE already high prior to writing the mode register). The state of address pins A0~A10, BS0 and BS1 in the same cycle as CS , RAS , CAS , WE going low is the data written in the mode register. One clock cycle is required to complete the write in the mode register. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. The mode register is divided into various fields depending on functionality. The burst length field uses A0~A2, burst type uses A3, addressing mode uses A4~A6, A7~A8, A10, BS0 and BS1 are used for vendor specific options or test mode. And the write burst length is programmed using A9. A7~A8, A10, BS0 and BS1 must be set to low for normal SDRAM operation. Refer to table for specific codes for various burst length, addressing modes and CAS latencies. BS0 and BS1 have to be set to "0" to enter the Mode Register.
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Device Operations (continued)
Bank Activate
The bank activate command is used to select a random row in an idle bank. By asserting low on RAS and CS with desired row and bank addresses, a row access is initiated. The read or write operation can occur after a time delay of tRCD(min) from the time of bank activation. tRCD(min) is an internal timing parameter of SDRAM, therefore it is dependent on operating clock frequency. The minimum number of clock cycles required between bank activate and read or write command should be calculated by dividing tRCD(min) with cycle time of the clock and then rounding off the result to the next higher integer. The SDRAM has 4 internal banks on the same chip and shares part of the internal circuitry to reduce chip area, therefore it restricts the activation of all banks simultaneously. Also the noise generated during sensing of each bank of SDRAM is high requiring some time for power supplies to recover before the other bank can be sensed reliably. tRRD(min) specifies the minimum time required between activating different banks. The number of clock cycles required between different bank activation must be calculated similar to tRCD specification. The minimum time required for the bank to be active to initiate sensing and restoring the complete row of dynamic cells is determined by tRAS(min) specification before a precharge command to that active bank can be asserted. The maximum time any bank can be in the active state is determined by tRAS(max). The number of cycles for both tRAS(min) and tRAS(max) can be calculated similar to tRCD specification.
Burst Read
internal writing may not have been completed yet. The burst write can be terminated by issuing a burst read and DQM for blocking data inputs or burst write in the same or the other active bank. The burst stop command is valid only at full page burst length where the writing continues at the end of burst and the burst is wrap around. The write burst can also be terminated by using DQM for blocking data and precharging the bank "tRDL" after the last data input to be written into the active row. See DQM OPERATION also.
DQM Operation
The DQM is used to mask input and output operation. It works similar to OE during read operation and inhibits writing during write operation. The read latency is two cycles from DQM and zero cycle for write, which means DQM masking occurs two cycles later in the read cycle and occurs in the same cycle during write cycle. DQM operation is synchronous with the clock, therefore the masking occurs for a complete cycle. The DQM signal is important during burst interrupts of write with read or precharge in the SDRAM. Due to asynchronous nature of the internal write, the DQM operation is critical to avoid unwanted or incomplete writes when the complete burst write is not required.
Precharge
The burst read command is used to access burst of data on consecutive clock cycles from an active row in an active bank. The burst read command is issued by asserting low on CS and CAS with WE being high on the positive edge of the clock. The bank must be active for at least tRCD(min) before the burst read command is issued. The first output appears CAS latency number of clock cycles after the issue of burst read command. The burst length, burst sequence and latency from the burst read command is determined by the mode register which is already programmed. The burst read can be initiated on any column address of the active row. The address wraps around if the initial address does not start from a boundary such that number of outputs from each I/O are equal to the burst length programmed in the mode register. The output goes into high-impedance at the end of the burst, unless a new burst read was initiated to keep the data output gapless. The burst read can be terminated by issuing another burst read or burst write in the same bank or the other active bank or a precharge command to the same bank. The burst stop command is valid at every page burst length.
Burst Write
The precharge operation is performed on an active bank by asserting low on CS , RAS , WE and A10/AP with valid BA of the bank to be precharged. The precharge command can be asserted anytime after tRAS(min) is satisfied from the bank activate command in the desired bank. "tRP" is defined as the minimum time required to precharge a bank. The minimum number of clock cycles required to complete row precharge is calculated by dividing "tRP" with clock cycle time and rounding up to the next higher integer. Care should be taken to make sure that burst write is completed or DQM is used to inhibit writing before precharge command is asserted. The maximum time any bank can be active is specified by tRAS(max). Therefore, each bank has to be precharged within tRAS(max) from the bank activate command. At the end of precharge, the bank enters the idle state and is ready to be activated again. Entry to Power Down, Auto refresh, Self refresh and Mode register Set etc, is possible only when all banks are in idle state.
Auto Precharge
The precharge operation can also be performed by using auto precharge. The SDRAM internally generates the timing to satisfy tRAS(min) and "tRP" for the programmed burst length and CAS latency. The auto precharge command is issued at the same time as burst read or burst write by asserting high on A10/AP. If burst read or burst write command is issued with low on A10/AP, the bank is left active until a new command is asserted. Once auto precharge command is given, no new commands are possible to that particular bank until the bank achieves idle state.
The burst write command is similar to burst read command, and is used to write data into the SDRAM consecutive clock cycles in adjacent addresses depending on burst length and burst sequence. By asserting low on CS , CAS and WE with valid column address, a write burst is initiated. The data inputs are provided for the initial address in the same clock cycle as the burst write command. The input buffer is deselected at the end of the burst length, even though the PRELIMINARY (January, 2005, Version 0.0) 14
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All Banks Precharge
All banks can be precharged at the same time by using Precharge all command. Asserting low on CS , RAS and
preferred refresh mode when the SDRAM is being used for normal data transactions. The auto refresh cycle can be performed once in 15.6us or a burst of 4096 auto refresh cycles once in 64ms.
Self Refresh
WE with high on A10/AP after both banks have satisfied tRAS(min) requirement, performs precharge on all banks. At the end of tRP after performing precharge all, all banks are in idle state.
Auto Refresh
The storage cells of SDRAM need to be refreshed every 64ms to maintain data. An auto refresh cycle accomplishes refresh of a single row of storage cells. The internal counter increments automatically on every auto refresh cycle to refresh all the rows. An auto refresh command is issued by asserting low on CS , RAS and CAS with high on CKE and
WE . The auto refresh command can only be asserted with all banks being in idle state and the device is not in power down mode (CKE is high in the previous cycle). The time required to complete the auto refresh operation is specified by "tRC(min)". The minimum number of clock cycles required can be calculated by dividing "tRC" with clock cycle time and then rounding up to the next higher integer. The auto refresh command must be followed by NOP's until the auto refresh operation is completed. All banks will be in the idle state at the end of auto refresh operation. The auto refresh is the
The self refresh is another refresh mode available in the SDRAM. The self refresh is the preferred refresh mode for data retention and low power operation of SDRAM. In self refresh mode, the SDRAM disables the internal clock and all the input buffers except CKE. The refresh addressing and timing is internally generated to reduce power consumption. The self refresh mode is entered from all banks idle state by asserting low on CS , RAS , CAS and CKE with high on WE . Once the self refresh mode is entered, only CKE state being low matters, all the other inputs including clock are ignored to remain in the self refresh. The self refresh is exited by restarting the external clock and then asserting high on CKE. This must be followed by NOP's for a minimum time of "tRC" before the SDRAM reaches idle state to begin normal operation. If the system uses burst auto refresh during normal operation, it is recommended to used burst 4096 auto refresh cycles immediately after exiting self refresh.
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Basic feature And Function Descriptions 1. CLOCK Suspend
1) Click Suspended During Write (BL=4)
2) Clock Suspended During Read (BL=4)
CLK CMD CKE Masked by CKE Internal CLK Masked by CKE WR RD
DQ(CL2) DQ(CL3)
D0 D0
D1 D1
D2 D2 Not Written
D3 D3
Q0
Q1 Q0
Q2 Q1
Q3 Q2 Suspended Dout Q3
Note: CLK to CLK disable/enable=1 clock
2. DQM Operation
1) Write Mask (BL=4)
2) Read Mask (BL=4)
CLK CMD WR RD
DQM Masked by CKE DQ(CL2) DQ(CL3) D0 D0 D1 D1 D3 D3 Q0 Hi-Z Hi-Z Masked by CKE Q2 Q1 Q3 Q2 Q3
DQM to Data-in Mask = 0CLK
DQM to Data-out Mask = 2
2) Read Mask (BL=4)
CLK CMD CKE RD
DQM DQ(CL2) DQ(CL3) Q0 Hi-Z Hi-Z Q2 Q1 Hi-Z Hi-Z Q4 Q3 Hi-Z Hi-Z Q6 Q5 Q7 Q6 Q8 Q7
* Note : 1. DQM makes data out Hi-Z after 2 clocks which should masked by CKE "L".
2. DQM masks both data-in and data-out.
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3. CAS Interrupt (I)
1) Read interrupted by Read (BL=4)Note 1 CLK CMD ADD DQ(CL2) DQ(CL3) tCCD
Note2
RD A
RD B QA0 QB0 QA0 QB1 QB2 QB0 QB1 QB3 QB2 QB3
2) Write interrupted by Write (BL =2) CLK CMD WR WR
Note2
3) Write interrupted by Read (BL =2)
WR tCCD A DB1 DQ(CL2) DQ(CL3) DA0 DA0 tCDL
Note3
RD
Note2
tCCD ADD DQ A DA0 B
B QB0 QB1 QB0 QB1
DB0
tCDL
Note3
Note : 1. By "Interrupt", It is possible to stop burst read/write by external command before the end of burst. By " CAS Interrupt", to stop burst read/write by CAS access; read, write and block write. 2. tCCD : CAS to CAS delay. (=1CLK) 3. tCDL : Last data in to new column address delay. (= 1CLK).
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4. CAS Interrupt (II) : Read Interrupted Write & DQM
(1) CL=2, BL=4 CLK i) CMD DQM DQ ii) CMD RD D0 D1 WR D2 D3 RD WR
DQM DQ iii) CMD DQM DQ iv) CMD DQM DQ (2) CL=3, BL=4 CLK RD RD
Hi-Z
D0
D1 WR
D2
D3
Hi-Z D0 D1 WR D2 D3
Q0
Hi-Z
Note 1
D0
D1
D2
D3
i) CMD DQM DQ ii) CMD DQM DQ iii) CMD DQM DQ iv) CMD DQM
RD
WR
D0 RD
D1 WR
D2
D3
D0 RD
D1 WR
D2
D3
D0 WR RD
D1 WR
D2
D3
Hi-Z DQ v) CMD DQM DQ Q0 RD
D0
D1 WR
D2
D3
Hi-Z
Note 2
D0
D1
D2
D3
* Note : 1. To prevent bus contention, there should be at least one gap between data in and data out. 2. To prevent bus contention, DQM should be issued which makes a least one gap between data in and data out.
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5. Write Interrupted by Precharge & DQM
CLK CMD DQM DQ D0 D1 D2 D3
Masked by DQM Note 2
WR
PRE
Note 1
Note : 1. To inhibit invalid write, DQM should be issued. 2. This precharge command and burst write command should be of the same bank, otherwise it is not precharge interrupt but only another bank precharge of dual banks operation.
6. Precharge
1) Normal Write (BL=4) CLK CMD DQ WR D0 D1 D2 D3 tRDL 2) Read (BL=4) CLK CMD DQ(CL2) DQ(CL3) RD Q0 Q1 Q0 PRE Q2 Q1 Q3 Q2 Q3 PRE
7. Auto Precharge
1) Normal Write (BL=4) CLK CMD DQ WR D0 D1 D2 D3
Note 1 Auto Precharge Starts
2) Read (BL=4) CLK CMD DQ(CL2) DQ(CL3) RD Q0 Q1 Q0 Q2 Q1 Q3 Q2
Note 1 Auto Precharge Starts
Q3
* Note : 1. The row active command of the precharge bank can be issued after tRP from this point. The new read/write command of other active bank can be issued from this point. At burst read/write with auto precharge, CAS interrupt of the same/another bank is illegal.
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8. Burst Stop & Interrupted by Precharge
1) Normal Write (BL=4) CLK CMD DQM DQ D0 D1 D2 D3
tRDL Note 1
2) Write Burst Stop (BL=8) CLK
WR
PRE
CMD DQM DQ
WR
STOP
D0
D1
D2
D3
D4
D5
tBDL Note 2
1) Read Interrupted by Precharge (BL=4) CLK CMD DQ(CL2) DQ(CL3) RD PRE Q0
Note 3
4) Read Burst Stop (BL=4) CLK CMD DQ(CL2) Q1
2
RD
STOP Q0 Q1 Q0
1
Q1 Q0
1
DQ(CL3)
Q1
2
9. MRS
Mode Register Set CLK
Note 1
CMD
PRE tRP
MRS 2CLK
ACT
Note : 1. tRDL: 1CLK 2. tBDL: 1CLK; Last data in to burst stop delay. Read or write burst stop command is valid at every burst length. 3. Number of valid output data after row precharge or burst stop: 1,2 for CAS latency = 2, 3 respectively. 4. PRE: All banks precharge if necessary. MRS can be issued only when all banks are in precharged state.
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10. Clock Suspend Exit & Power Down Exit
1) Clock Suspend (=Active Power Down) Exit CLK CKE Internal CLK CMD
Note 1
2) Power Down (=Precharge Power Down) Exit CLK
tSS
CKE Internal CLK RD CMD
Note 2
tSS
NOP
ACT
11. Auto Refresh & Self Refresh
Note 3
1) Auto Refresh
CKE Internal CLK CMD
Note 4
~
CLK PRE AR
Note 5
CMD
tRP
tRC
Note 6
2) Self Refresh CLK
Note 4
~
~~
CMD CKE
PRE
SR
~
~
tRP
tRC
* Note : 1. Active power down : one or more bank active state. 2. Precharge power down : both bank precharge state. 3. The auto refresh is the same as CBR refresh of conventional DRAM. No precharge commands are required after Auto Refresh command. During tRC from auto refresh command, other command can not be accepted. 4. Before executing auto/self refresh command, both banks must be idle state. 5. MRS, Bank Active, Auto/Self Refresh, Power Down Mode Entry. 6. During self refresh mode, refresh interval and refresh operation are performed internally. After self refresh entry, self refresh mode is kept while CKE is LOW. During self refresh mode, all inputs expect CKE will be don't cared, and outputs will be in Hi-Z state. During tRC from self refresh exit command, any other command can not be accepted. Before/After self refresh mode, burst auto refresh cycle (4K cycles ) is recommended.
~
~
~ ~
CMD
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12. About Burst Type Control
Basic MODE Random MODE Sequential counting Interleave counting Random column Access tCCD = 1 CLK At MRS A3="0". See the BURST SEQUENCE TABE.(BL=4,8) BL=1,2,4,8 and full page wrap around. At MRS A3=" 1". See the BURST SEQUENCE TABE.(BL=4,8) BL=4,8 At BL=1,2 Interleave Counting = Sequential Counting Every cycle Read/Write Command with random column address can realize Random Column Access. That is similar to Extended Data Out (EDO) Operation of convention DRAM.
13. About Burst Length Control
1 Basic MODE 2 4 8 Special MODE At MRS A2,1,0 = "000". At auto precharge, tRAS should not be violated. At MRS A2,1,0 = "001". At auto precharge, tRAS should not be violated. At MRS A2,1,0 = "010" At MRS A2,1,0 = "011".
Interrupt MODE
At MRS A9="1". BRSW Read burst = 1,2,4,8, full page/write Burst =1 At auto precharge of write, tRAS should not be violated. Before the end of burst, Row precharge command of the same bank RAS Interrupt Stops read/write burst with Row precharge. (Interrupted by Precharge) tRDL= 2 with DQM, valid DQ after burst stop is 1,2 for CL=2,3 respectively During read/write burst with auto precharge, RAS interrupt cannot be issued. Before the end of burst, new read/write stops read/write burst and starts new read/write burst or block write. CAS Interrupt During read/write burst with auto precharge, CAS interrupt can not be issued.
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Power On Sequence for Low Power SDRAM
0 CLOCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
~~ ~~
CKE
~ ~
~~ ~
CS
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
BS1
~ ~
BS0
~ ~
ADDR
~ ~ ~ ~
CAS
~ ~ ~ ~
RAS
~ ~ ~ ~
~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~
KEY
KEY
Ra
~ ~ ~ ~ ~ ~
Ra
~ ~
~ ~
~ ~
DQM
High level is necessary
~ ~
DQ
tPR
tRC
tRC
~ ~
High-Z
~ ~
~ ~
WE
~ ~ ~ ~
A10/AP
~ ~
Precharge (All Banks)
Auto Refresh
Auto Refresh
Normal MRS
Extended MRS
Row Active (A-Bank) : Don't care
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Single Bit Read-Write-Read Cycles (Same Page) @CAS Latency=3, Burst Length=1
tCH 0 CLOCK tCC CKE tRAS tRC
*Note 1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
tCL High
tSH tSS
CS tRCD tSH RAS tSS tSH CAS tSS tSH ADDR tSS
*Note 2 *Note 2,3
tRP
tCCD
tSS Ca Cb tSH
*Note 2,3 *Note 2,3 *Note 4 *Note 2
Ra
Cc
Rb
BS0, BS1
BS
BS
BS
BS
BS
BS
*Note 3
*Note 3
*Note 3
*Note 4
A10/AP
Ra
Rb
tSH WE tSS tSS DQM tRA
C
tSH
tSA
C
tSH Qa tOH tSS tSHZ Db Qc
DQ tSLZ
Row Active
Read
Write
Read Precharge
Row Active
: Don't care
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* Note : 1. All inputs can be don't care when CS is high at the CLK high going edge. 2. Bank active & read/write are controlled by BS0, BS1.
BS1
BS0
Active & Read/Write
0 0 1 1
0 1 0 1
Bank A Bank B Bank C Bank D
3. Enable and disable auto precharge function are controlled by A10/AP in read/write command.
A10/AP BS1 BS0 Operation
0 0 0 1 1 0 0 1 1 1
0 1 0 1 0 1 0 1
Disable auto precharge, leave bank A active at end of burst. Disable auto precharge, leave bank B active at end of burst. Disable auto precharge, leave bank C active at end of burst. Disable auto precharge, leave bank D active at end of burst. Enable auto precharge, precharge bank A at end of burst. Enable auto precharge, precharge bank B at end of burst. Enable auto precharge, precharge bank C at end of burst. Enable auto precharge, precharge bank D at end of burst.
4. A10/AP and BS0, BS1 control bank precharge when precharge command is asserted.
A10/AP BS1 BS0 Precharge
0 0 0 0 1
0 0 1 1 X
0 1 0 1 X
Bank A Bank B Bank C Bank D All Banks
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Read & Write Cycle at Same Bank @Burst Length=4
0 CLOCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CKE tRC CS tRCD *Note 1
High
RAS *Note 2 CAS
ADDR
Ra
Ca0
Rb
Cb0
BS0
BS1
A10/AP
Ra
Rb
WE
DQM tOH DQ (CL = 2) Qa0 tRAC *Note 3 tSAC tOH DQ (CL = 3) Qa0 tRAC *Note 3 tSAC Qa1 Qa2 Qa3 *Note 4 Db0 Db1 Db2 tRDL Db3 Qa1 Qa2 Qa3 *Note 4 Db0 Db1 Db2 Db3 tRDL
tSHZ
tSHZ
Row Active (A-Bank)
Read (A-Bank)
Precharge (A-Bank)
Row Active (A-Bank)
Write (A-Bank)
Precharge (A-Bank) : Don't care
*Note : 1. Minimum row cycle times is required to complete internal DRAM operation. 2. Row precharge can interrupt burst on any cycle. [CAS latency-1] valid output data available after Row enters precharge. Last valid output will be Hi-Z after tSHZ from the clock. 3. Access time from Row address. tCC*(tRCD + CAS latency-1) + tSAC 4. Output will be Hi-Z after the end of burst. (1,2,4 & 8)
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Page Read & Write Cycle at Same Bank @Burst Length=4
0 CLOCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CKE
High
CS tRCD
RAS *Note 2 CAS
ADDR
Ra
Ca
Cb
Cc
Cd
BS0
BS1
A10/AP
Ra tCDL tRDL
WE
*Note1 DQM
*Note3
DQ (CL=2)
Qa0
Qa1
Qb0
Qb1
Qb2
Dc0
Dc1
Dd0
Dd1
DQ (CL=3)
Qa0
Qa1
Qb0
Qb1
Dc0
Dc1
Dd0
Dd1
Row Active (A-Bank)
Read (A-Bank)
Read (A-Bank)
Write (A-Bank)
Write (A-Bank)
Precharge (A-Bank)
: Don't care
*Note : 1. To write data before burst read ends, DQM should be asserted three cycle prior to write command to avoid bus contention. 2. Row precharge will interrupt writing. Last data input, tRDL before Row precharge, will be written. 3. DQM should mask invalid input data on precharge command cycle when asserting precharge before end of burst. Input data after Row precharge cycle will be masked internally.
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Page Read Cycle at Different Bank @Burst Length = 4
0 CLOCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CKE
*Note 1
High
CS
RAS
*Note 2
CAS
ADDR
RAa
RBb
CAa
RCc
CBb
RDd
CCc
CDd
BS1
BS0
A10/AP
RAa
RBb
RCc
RDd
WE
DQM
DQ (CL=2)
QAa0 QAa1
QAa2
QBb0
QBb1 QBb2
QCc0
QCc1
QCc2
QDd0 QDd1 QDd2
DQ (CL=3)
QAa0 QAa1
QAa2
QBb0
QBb1 QBb2
QCc0
QCc1
QCc2
QDd0 QDd1 QDd2
Row Active (A-Bank)
Read (A-Bank) Row Active (B-Bank)
Read (B-Bank) Row Active (C-Bank)
Read (C-Bank) Row Active (D-Bank) Precharge (B-Bank)
Read (D-Bank) Precharge (C-Bank)
Precharge (D-Bank)
Precharge (A-Bank)
: Don't care
* Note : 1. CS can be don't care when RAS , CAS and
WE
are high at the clock high going edge.
2. To interrupt a burst read by row precharge, both the read and the precharge banks must be the same.
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Page Write Cycle at Different Bank @Burst Length=4
0 CLOCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CKE
High
CS
RAS *Note 2 CAS
ADDR
RAa
RBb
CAa
CBb
RCc
RDd
CCc
CDd
BS1
BS0
A10/AP
RAa
RBb
RCc
RDd
DQ
DAa0 DAa1
DAa2
DAa3
DBb0 DBb1
DBb2
DBb3
DCc0
DCc1
DDd0
DDd1
CDd2 tRDL
tCDL
WE *Note 1 DQM
Row Active (A-Bank)
Write (A-Bank)
Write (B-Bank)
Row Active (D-Bank) Write (C-Bank)
Write (D-Bank)
Precharge (All Banks)
Row Active (B-Bank)
Row Active (C-Bank)
: Don't care
* Note: 1. To interrupt burst write by Row precharge, DQM should be asserted to mask invalid input data. 2. To interrupt burst write by Row precharge, both the write and precharge banks must be the same.
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Read & Write Cycle at Different Bank @Burst Length=4
0 CLOCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CKE
High
CS
RAS
CAS
ADDR
RAa
CAa
RDb
CDb
RBc
CBc
BS1
BS0
A10/AP
RAa
RDb
RBC tCDL *Note 1
WE
DQM
DQ (CL=2)
QAa0
QAa1
QAa2 QAa3
DDb0
DDb1
DDb2
DDb3
QBc0
QBc1
QBc2
DQ (CL=3)
QAa0
QAa1 QAa2
QAa3
DDb0 DDb1
DDb2
DDb3
QBc0
QBc1
Row Active (A-Bank)
Read (A-Bank)
Precharge (A-Bank)
Write (D-Bank)
Read (B-Bank)
Row Active (D-Bank)
Row Active (B-Bank) : Don't care
* Note : tCDL should be met to complete write.
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Read & Write Cycle with Auto Precharge @Burst Length=4
0 CLOCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CKE
High
CS
RAS
CAS
ADDR
RAa
RBb
CAa
CBb
BS1
BS0
A10/AP
RAa
RBb
WE
DQM
DQ (CL=2)
QAa0
QAa1
QAa2 QAa3
DDb0
DDb1
DDb2
DDb3
DQ (CL=3)
QAa0
QAa1 QAa2
QAa3
DDb0 DDb1
DDb2
DDb3
Row Active (A-Bank)
Read with Auto Precharge (A-Bank) Row Active (D-Bank)
Auto Precharge Start Point (A-Bank/CL=3) Auto Precharge Start Point (A-Bank/CL=2)
Write with Auto Precharge (D-Bank)
Auto Precharge Start Point (D-Bank)
: Don't care
*Note : tRCD should be controlled to meet minimum tRAS before internal precharge start. (In the case of Burst Length=1 & 2, BRSW mode)
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Clock Suspension & DQM Operation Cycle @CAS Latency = 2, Burst Length=4
0 CLOCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CKE
CS
RAS
CAS
ADDR
Ra
Ca
Cb
Cc
BS1
BS0
A10/AP
Ra
WE
* Note 1
DQM
DQ
Qa0
Qa1
Qa2
Qa3 tSHZ
Qb0
Qb1 tSHZ
Dc0
Dc2
Row Active
Read Bank 0
Clock Suspension
Read Bank 0
Read DQM Write Bank 0
Write DQM Clock Suspension
: Don't care
* Note : DQM needed to prevent bus contention.
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Read Interrupted by Precharge Command & Read Burst Stop Cycle @Burst Length=Full Page
0 CLOCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CKE
High
CS
RAS
CAS
ADDR
RAa
CAa
CAb
BS1
BS0
A10/AP
RAa
WE
DQM
1
1
DQ (CL=2)
QAa0
QAa1
QAa2
QAa3 QAa4
QAb0
QAb1
QAb2
QAb3
QAb4
QAb5
2
2
DQ (CL=3)
QAa0
QAa1
QAa2 QAa3
QAa4
QAb0 QAb1
QAb2
QAb3
QAb4
QAb5
Row Active (A-Bank)
Read (A-Bank)
Burst Stop
Read (A-Bank)
Precharge (A-Bank)
: Don't care
* Note : 1. At full page mode, burst is wrap-around at the end of burst. So auto precharge is impossible. 2. About the valid DQ's after burst stop, it is same as the case of RAS interrupt.
Both cases are illustrated above timing diagram. See the label 1,2 on them. But at burst write, burst stop and RAS interrupt should be compared carefully. Refer the timing diagram of "Full page write burst stop cycle". 3. Burst stop is valid at every burst length.
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Write Interrupted by Precharge Command & Write Burst Stop Cycle @ Burst Length = Full Page
0 CLOCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
CKE
High
CS
RAS
CAS
ADDR
RAa
CAa
CAb
BS1
BS0
A10/AP
RAa tBDL
* Note 2
tRDL
WE
DQM
DQ
DAa0
DAa1
DAa2
DAa3 DAa4
DAb0
DAb1
DAb2
DAb3
DAb4
DAb5
Row Active (A-Bank)
Write (A-Bank)
Burst Stop
Write (A-Bank)
Precharge (A-Bank)
: Don't care
* Note : 1. At full page mode, burst is wrap-around at the end of burst. So auto precharge is impossible. 2. Data-in at the cycle of interrupted by precharge cannot be written into the corresponding memory cell. It is defined by AC parameter of tRDL(=2CLK). DQM at write interrupted by precharge command is needed to prevent invalid write. DQM should mask invalid input data on precharge command cycle when asserting precharge before end of burst. Input data after Row precharge cycle will be masked internally. 3. Burst stop is valid at every burst length.
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Active/Precharge Power Down Mode @CAS Lantency=2, Burst Length=4
0 CLOCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
~ ~
* Note 2
tSS CKE
* Note 1
tSS
tSS
~ ~
tSS Ra
*Note 3
~ ~
CS
~ ~
~ ~
~ ~ ~ ~
CAS
~ ~ ~ ~
RAS
~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~
~ ~
Ca
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
DQM
~ ~ ~ ~
WE
~ ~ ~ ~
A10/AP
Ra
~ ~ ~ ~
BS0
~ ~ ~ ~
BS1
~ ~ ~ ~
ADDR
~ ~
~ ~
~ ~ ~ ~ ~ ~ ~ ~ ~ ~
tSHZ
DQ
Qa0
Qa1
Qa2
Precharge Power-down Entry
Precharge Power-down Exit Row Active Active Power-down Entry Active Power-down Exit
Read
Precharge
: Don't care
* Note : 1. All banks should be in idle state prior to entering precharge power down mode. 2. CKE should be set high at least "1CLK + tSS" prior to Row active command. 3. Cannot violate minimum refresh specification. (64ms)
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AMIC Technology, Corp.
A43L2632
Self Refresh Entry & Exit Cycle
0 CLOCK
* Note 2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
~ ~
* Note 4
* Note 1
* Note 3
tSS CS
* Note 5
~ ~
~ ~
~ ~
* Note 7
~ ~
RAS
~ ~ ~ ~
~ ~
CKE
tSS
~ ~
tRC
min. * Note 6
~ ~ ~ ~ ~ ~ ~ ~
* Note 7
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
DQ
Hi-Z
Hi-Z
Self Refresh Entry
Self Refresh Exit
~ ~
~ ~
DQM
~ ~ ~ ~
WE
~ ~ ~ ~
A10/AP
~ ~ ~ ~
BS0, BS1
~ ~ ~ ~
ADDR
~ ~ ~ ~
CAS
* Note : TO ENTER SELF REFRESH MODE 1. CS , RAS & CAS and CKE should be low at the same clock cycle. 2. After 1 clock cycle, all the inputs including the system clock can be don't care except for CKE. 3. The device remains in self refresh mode as long as CKE stays "Low". (cf.) Once the device enters self refresh mode, minimum tRAS is required before exit from self refresh. TO EXIT SELF REFRESH MODE 4. System clock restart and be stable before returning CKE high. 5. CS starts from high. 6. Minimum tRC is required after CKE going high to complete self refresh exit. 7. 4K cycle of burst auto refresh is required before self refresh entry and after self refresh exit. If the system uses burst refresh.
~ ~ ~ ~ ~ ~ ~ ~ ~ ~
Auto Refresh : Don't care
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A43L2632
Mode Register Set Cycle Auto Refresh Cycle
0 CLOCK
1
2
3
4
5
6
0
1
2
3
4
5
6
7
8
9
10
CKE *Note 2 CS
High
High
tRC RAS
* Note 1
* Note 3
Hi-Z
Hi-Z
MRS New Command
Auto Refresh
~ ~
DQ
~ ~
DQM
~ ~ ~ ~
WE
~ ~ ~ ~
ADDR
Key
Ra
~ ~ ~ ~
CAS
~ ~ ~ ~
New Command : Don't care
* All banks precharge should be completed before Mode Register Set cycle and auto refresh cycle.
MODE REGISTER SET CYCLE * Note : 1. CS , RAS , CAS & mode register.
WE
activation at the same clock cycle with address key will set internal
2. Minimum 2 clock cycles is required before new RAS activation.
3. Please refer to Mode Register Set table.
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AMIC Technology, Corp.
~ ~ ~ ~
~ ~
~ ~
~ ~
A43L2632
Function Truth Table (Table 1)
Current State
CS
H L L L
RAS CAS
X H H H L L L L X H H H H L L L X H H H H L L L X H H H H L L L X H H H H L L X H H L H H L L X H H L L H H L X H H L L H H L X H H L L H H L X H H L L H L
WE
X H L X H L H L X H L H L H L X X H L H L H L X X H L H L H L X X H L H L X X
BA
Address
Action
Note
X X X BA BA BA X X X X BA BA BA BA X X X X BA BA BA BA X X X X BA BA BA BA X X X X BA BA BA X
X X X RA A10/AP X OP Code X X X
NOP NOP ILLEGAL Row Active; Latch Row Address NOP Auto Refresh or Self Refresh Mode Register Access NOP NOP ILLEGAL 2 4 5 5 2 2
CA, A10/AP ILLEGAL
IDLE
L L L L H L
Row Active
L L L L L L H L L L L L L L H L L L L L L L H L L L L L L
CA,A10/AP Begin Read; Latch CA; Determine AP CA,A10/AP Begin Write; Latch CA; Determine AP RA PA X X X X ILLEGAL Precharge ILLEGAL NOP(Continue Burst to End Row Active) NOP(Continue Burst to End Row Active) Term burst Row Active 3 3 2 3 2
Read
CA,A10/AP Term burst; Begin Read; Latch CA; Determine AP CA,A10/AP Term burst; Begin Write; Latch CA; Determine AP RA A10/AP X X X X ILLEGAL Term Burst; Precharge timing for Reads ILLEGAL NOP(Continue Burst to EndRow Active) NOP(Continue Burst to EndRow Active) Term burst Row Active
Write
CA,A10/AP Term burst; Begin Read; Latch CA; Determine AP CA,A10/AP Term burst; Begin Write; Latch CA; Determine AP RA A10/AP X X X X ILLEGAL Term Burst; Precharge timing for Writes ILLEGAL NOP(Continue Burst to EndPrecharge) NOP(Continue Burst to EndPrecharge) ILLEGAL
3 3 2 3
Read with Auto Precharge
CA,A10/AP ILLEGAL CA,A10/AP ILLEGAL RA, PA X ILLEGAL ILLEGAL
2 2 2
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AMIC Technology, Corp.
A43L2632
Function Truth Table (Table 1, Continued)
Current State
CS
H L
RAS CAS WE
X H H H H L L X H H H L L L X H H H L L L X H H L L X H H H L X H H L L H L X H H L H H L X H H L H H L X H L H L X H H L X X H L H L X X X H L X H L X X H L X H L X X X X X X X H L X X
BS
Address
Action
Note
X X X BS BS BS X X X X BS BS BS X X X X BS BS BS X X X X X X X H X X X
X X X CA,A10/AP CA,A10/AP RA, PA X X X X CA,A10/AP RA A10/AP X X X X CA,A10/AP RA A10/AP X X X X X X X X X X X
NOP(Continue Burst to EndPrecharge) NOP(Continue Burst to EndPrecharge) ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL NOPIdle after tRP NOPIdle after tRP ILLEGAL ILLEGAL ILLEGAL NOPIdle after tRP ILLEGAL NOPRow Active after tRCD NOPRow Active after tRCD ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL NOPIdle after tRC NOPIdle after tRC ILLEGAL ILLEGAL ILLEGAL NOPIdle after 2 clocks NOPIdle after 2 clocks ILLEGAL ILLEGAL ILLEGAL AP = Auto Precharge PA = Precharge All 2 2 2 2 2 2 2 4 2 2 2
Write with Auto Precharge
L L L L L H L L
Precharge
L L L L H L L L L L L H L
Row Activating
Refreshing
L L L H
Mode Register Accessing
L L L L
Abbreviations RA = Row Address NOP = No Operation Command
BS = Bank Address CA = Column Address
Note: 1. All entries assume that CKE was active (High) during the preceding clock cycle and the current clock cycle. 2. Illegal to bank in specified state: Function may be legal in the bank indicated by BA, depending on the state of that bank. 3. Must satisfy bus contention, bus turn around, and/or write recovery requirements. 4. NOP to bank precharging or in idle state. May precharge bank indicated by BS (and PA). 5. Illegal if any banks is not idle.
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AMIC Technology, Corp.
A43L2632
Function Truth Table for CKE (Table 2)
Current State CKE n-1 H CKE n X
CS
X H L L L L X X H L L L L X X H L L L L L L X X X X X
RAS CAS
X X H H H L X X X H H H L X X X H H H L L L X X X X X X X H H L X X X X H H L X X X X H H L H L L X X X X X
WE
X X H L X X X X X H L X X X X X H L X H H L X X X X X
Address
Action
Note
X X X X X X X X X X X X X X X X X X X RA X X X X X X
INVALID Exit Self RefreshABI after tRC Exit Self RefreshABI after tRC ILLEGAL ILLEGAL ILLEGAL NOP(Maintain Self Refresh) INVALID Exit Power DownABI Exit Power DownABI ILLEGAL ILLEGAL ILLEGAL NOP(Maintain Power Down Mode) Refer to Table 1 Enter Power Down Enter Power Down ILLEGAL ILLEGAL Row (& Bank ) Active Enter Self Refresh NOP Refer to Operations in Table 1 Begin Clock Suspend next cycle Exit Clock Suspend next cycle Maintain clock Suspend 9 9 8 8 8 7 7 6 6
L L Self Refresh L L L L H Both Bank Precharge Power Down L L L L L L H H H All Banks Idle H H H H H L Any State Other than Listed Above H H L L
H H H H H L X H H H H H L H L L L L L L L L H L H L
OPCODE MRS
Abbreviations : ABI = All Banks Idle Note: 6. After CKE's low to high transition to exit self refresh mode, a minimum of tRC(min) has to be elapse before issuing a new command. 7. CKE low to high transition is asynchronous as if it restarts internal clock. A minimum setup time "tSS + one clock" must be satisfied before any command can be issued other than exit. 8. Power-down and self refresh can be entered only when all the banks are in idle state. 9. Must be a legal command.
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AMIC Technology, Corp.
A43L2632
Ordering Information
Part No. Min. Cycle Time (ns) Max. Clock Frequency (MHz) Access Time Package
A43L2632V-6 A43L2632V-7
6 7
166 143
5.5 ns 5.5 ns
86 TSOP (II) 86 TSOP (II)
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AMIC Technology, Corp.
A43L2632
Package Information TSOP 86L (Type II) Outline Dimensions
unit: inches/mm
D 86 44
Detail "A"
E1
E
c 1 43
R1 0.21 REF R2 0.25 Gauge Plane A A1 -Cb 0.10 D Seating Plane L1 Detail "A" 1 L
S -CA2
0.665 REF
e
Dimensions in inches
Dimensions in mm Min 0.05 0.95 0.17 0.12 Nom 0.10 1.00 22.22 BSC 0.61 REF 11.76 BSC 10.16 BSC 0.50 BSC Max 1.20 0.15 1.05 0.27 0.21
Symbol
A A1 A2 b c D S E E1 e L L1 R1 R2 1
Min 0.002 0.037 0.007 0.005
Nom 0.004 0.039 0.875 BSC 0.024 REF 0.463 BSC 0.400 BSC 0.020 BSC
Max 0.047 0.006 0.041 0.011 0.008
0.016 0.005 0.005 0 0
0.020 0.031 REF -
0.024 0.010 8 -
0.40 0.12 0.12 0 0
0.50 0.80 REF -
0.60 0.25 8 -
Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash.
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AMIC Technology, Corp.

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